martes, 8 de mayo de 2018

Huawei's Hisilicon Kirin 980 to be powered by TSMC's 7nm manufacturing process

Just last month, the Huawei Mate 20's AnTuTu benchmark score leaked revealing the performance of the company's Hisilicon Kirin 980 chip and suggesting it will be better than the latest Snapdragon 845 chipset. And now, we have some more details regarding the Kirin 980. The report reveals that the new chip will arrive just in time for the Huawei Mate 20's launch during the second half of this year powered by TSMC's 7nm FinFET manufacturing technology. It's also believed to adopt the Cambricon's latest AI chip technology as part of the 1M series. Thanks to the improved manufacturing...



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Just last month, the Huawei Mate 20's AnTuTu benchmark score leaked revealing the performance of the company's Hisilicon Kirin 980 chip and suggesting it will be better than the latest Snapdragon 845 chipset. And now, we have some more details regarding the Kirin 980. The report reveals that the new chip will arrive just in time for the Huawei Mate 20's launch during the second half of this year powered by TSMC's 7nm FinFET manufacturing technology. It's also believed to adopt the Cambricon's latest AI chip technology as part of the 1M series. Thanks to the improved manufacturing...



from GSMArena.com - Latest articles https://ift.tt/2I5wd3R
via IFTTT

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